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Specification:
Brand new
Type: RMA-223
Volume: 10*10ml/10cc
Dimension: approx.95*35*23mm
Feature:
Viscous force lasting, not easy to dry.
It is the mixture of high-quality alloyed powder and resinic pasty flux, can avoid the pale yellow residue.
Can be used for PCB, BGA, PGA reworking, and soldering and reballing of computer and phone chips.
Package included:
5pcs x solder paste
Note:
No Ag and Tin in it.
Please allow 0-1cm errors due to manual measurement.
Item color displayed in photos may be showing slightly different on your computer monitor since monitors are not calibrated same.