General information

Type

CPU / Microprocessor

Market segment

Server

Family

In Xeon E3-1200

Model number?

E3-1240

CPU part numbers

• CM62503is an OEM/tray microprocessor

• BX80623E31240is a boxed microprocessor

Frequency?

3300 MHz

Maximum turbo frequency

3700 MHz (1 core)
3600 MHz (2 cores)
3500 MHz (3 cores)
3400 MHz (4 cores)

Bus speed?

5 GT/s DMI

Clock multiplier?

33

Package

1155-land Flip-Chip Land Grid Array (FCLGA 1155)

Socket

Socket 1155 / H2 / LGA1155

Size

1.48" x 1.48" / 3.75cm x 3.75cm

Introduction date

Apr 3, 2011

End-of-Life date

Last order date is December 27, 2013
Last shipment date for tray processors is December 5, 2014

Price at introduction

$250

S-spec numbers

Architecture / Microarchitecture

Microarchitecture

Sandy Bridge

Platform

Bromolow

Processor core?

Sandy Bridge

Core stepping?

D2 (SR00K)

CPUID

206A7 (SR00K)

Manufacturing process

0.032 micron High-K metal gate process

Data width

64 bit

The number of CPU cores

4

The number of threads

8

Floating Point Unit

Integrated

Level 1 cache size?

4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches

Level 2 cache size?

4 x 256 KB 8-way set associative caches

Level 3 cache size

8 MB 16-way set associative shared cache

Physical memory

32 GB

Multiprocessing

Uniprocessor

Extensions and Technologies

• MMX instructions

• SSE / Streaming SIMD Extensions

• SSE2 / Streaming SIMD Extensions 2

• SSE3 / Streaming SIMD Extensions 3

• SSSE3 / Supplemental Streaming SIMD Extensions 3

• SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4?

• AES / Advanced Encryption Standard instructions

• AVX / Advanced Vector Extensions

• EM64T / Extended Memory 64 technology / In 64?

• NX / XD / Execute disable bit?

• VT-x / Virtualization technology?

• VT-d / Virtualization for directed I/O

• TBT 2.0 / Turbo Boost technology 2.0?

• TXT / Trusted Execution technology

• HT / Hyper-Threading technology?

Low power features

• C1, C3 and C6 thread states

• C1/C1E, C3 and C6 core states

• C1/C1E, C3 and C6 package states

• Enhanced SpeedStep technology?

Integrated peripherals / components

Integrated graphics

None

Memory controller

The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1066, DDR3-1333
Maximum memory bandwidth (GB/s): 21.3
ECC supported: Yes

Other peripherals

• Direct Media Interface 2.0

• PCI Express 2.0 interface

Electrical / Thermal parameters

Minimum/Maximum operating temperature?

5°C - 69.1°C

Minimum power dissipation

5.5 Watt (C6 state)

Thermal Design Power?

80 Watt