In Core i3-2100 i3 2100 3.1 GHz Dual-Core CPU Processor 3M 65W LGA 1155
in-core-i3-2100-i3-2100-3-1-ghz-dual-core-cpu-processor-3m-65w-lga-1155
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  • Brand Name:In
  • In Model:In Core i3-2100
  • Support Memory Channels:2
  • PCIe VERSION:PCIe 2.0
  • Application:Desktop
  • Number OF Therads:4
  • Usage Scenario:Others
  • Support Memory Type:DDR3
  • Support Chipset Models:In B75
  • Processor Type:In Core i3
  • Chip Process:32 nanometers
  • Default TDP / TDP:65W
  • Origin:MY(Origin)
  • Unlocked:Yes
  • Socket Type:LGA 1155
  • Item Condition:Used
  • Type:Dual-Core
  • GPU-built:Yes
  • Launch Date:2004
  • L3 Cache Capacity:3 MBMB
  • Number of Cores:Dual-Core
  • Package:No
  • L2 Cache Capacity:512 KBMB
  • Model Number:In Core i3-2100
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In Core i3-2100 specifications

The specs can be used for short-term
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General information
Type CPU / Microprocessor
Market segment Desktop
Family In Core i3
Model number ? i3-2100
CPU part numbers
  • CM61600 is an OEM/tray microprocessor
  • BX80623I32100 is a boxed processor with fan and heatsink (English version)
  • BXC80623I32100 is a boxed processor with fan and heatsink (Chinese version)
Frequency ? 3100 MHz
Bus speed ? 5 GT/s DMI
Clock multiplier ? 31
Package 1155-land Flip-Chip Land Grid Array
Socket Socket 1155 / H2 / LGA1155
Size 1.48" x 1.48" / 3.75cm x 3.75cm
Weight 0.9oz / 26.8g (CPU)
11.9oz / 338.5g (box)
Fan/heatsink E97379-001
Introduction date Feb 20, 2011
End-of-Life date Last order date for tray processors is August 23, 2013
Last shipment date for tray processors is February 7, 2014
Price at introduction $117
S-spec numbers
Part number ES/QS processors Production processors
QA25 SR05C
BX80623I32100 +
BXC80623I32100 +
CM61600 + +
Architecture / Microarchitecture
Microarchitecture Sandy Bridge
Processor core ? Sandy Bridge
Core stepping ? Q0 (QA25, SR05C)
Manufacturing process 0.032 micron High-K metal gate process
Data width 64 bit
The number of CPU cores 2
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size ? 2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size ? 2 x 256 KB 8-way set associative caches
Level 3 cache size 3 MB 12-way set associative shared cache
Cache latency 4 (L1 cache)
12 (L2 cache)
27 (L3 cache)
Physical memory 32 GB
Multiprocessing Uniprocessor
Features
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ?
  • AVX / Advanced Vector Extensions
  • EM64T / Extended Memory 64 technology / In 64 ?
  • NX / XD / Execute disable bit ?
  • HT / Hyper-Threading technology ?
  • VT-x / Virtualization technology ?
Low power features Enhanced SpeedStep technology ?
Integrated peripherals / components
Integrated graphics GPU Type: HD 2000
Microarchitecture: Gen 6
Execution units: 6
Base frequency (MHz): 850
Maximum frequency (MHz): 1100
The number of supported displays: 2
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1066, DDR3-1333
Maximum memory bandwidth (GB/s): 21.3
Other peripherals
  • Direct Media Interface 2.0
  • PCI Express 2.0 interface
Electrical / Thermal parameters
Maximum operating temperature ? 69.1°C
Thermal Design Power ? 65 Watt

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